Chair's Message
Symposium Committee
Call for Papers & Proposals
Call for papers
Call for Special Sessions
Call for Workshop & Tutorial
Call for Abstract-reviewed papers


Important Dates

  • Preliminary Full Paper Submission  
  • (3 to 6 pages in PDF format; without author names & affiliations)

Start:  18 August 2017

End:    24 November 2017

  • Abstract Reviewed Paper Submission
  • (with author names & affiliations)
 18 Aug. 2017 to 08 Jan. 2018
  • Paper Acceptance Notification

January 2018

  • Final Paper Due

28 February 2018

Paper Template

Paper Topics of Interest

TC-1 EMC Management 
  • Personnel & Laboratory Accreditation
  • EMC Education
  • Legal Issues

TC-2 EMC Measurements
  • Test Instrumentation & Facilities
  • Measurement Techniques
  • Standards and Regulations

TC-3 EM Environment
  • EM Signal Environment
  • Atmospheric & Man-Made Noise

TC-4 EM Interference
  • Shielding, Gasketing & Filtering
  • Cables and Connectors
  • Circuit & System EMC Analysis
  • Grounding

TC-5 High Power Electromagnetics
  • ESD & Transients
  • EMP, IEMI & Lightning
  • Information Leakage
  • Electric Power EMC

TC-6 Spectrum Engineering
  • Spectrum Characterization and Modeling
  • Design for Spectrally Efficient Systems
  • Adaptive Interference Mitigation

TC-7 Low Frequency EMC

  • Power Quality and Conducted EMC
  • Power Electronics

TC-9 Computational Electromagnetics
  • Computer Modeling Methods
  • Tools and Techniques
  • Validation Methods
  • Statistical Analysis
TC-10 Signal and Power Integrity
  See Embedded Conference on SIPI

TC-11 Nanotechnology & Advanced Materials
  • Nanomaterials and Nanostructures
  • Smart Materials

TC-12 EMC for Emerging Wireless Technologies
  • EMC Planning/Testing/Specifications
  • Wireless Coexistence
  • Intra-System Interference
  • Wireless OTA Testing

SC-1 Smart Grid EMC
  • RF Environment
  • Performance Degradation

SC-5 Power Electronics EMC
  • Power Electronics Converters EMI/EMC
  • Switching Frequency Schemes
  • Grid-Connected PV Systems, Wind Farms, Automotive, Aerospace, and Comms Systems
  • Inverters
SC-6 Unmanned Aircraft Systems EMC
  • Spectrum Management on Intra and Inter-System Interactions
  • System Level Design, Testing, Modeling/Simulation
  • Robust Performance in the Presence of High Intensity Radiated Fields (HIRF)
SC-7 Aeronautics and Space EMC
  • EMI/EMC Issues in Aircraft, Spacecraft & Space Launch Vehicles, Robotic and Crewed
  • EMC Analysis, Design, Test and Performance of Space Systems
  • Part, Board, Box, System, Multi-System, Planetary & Interplanetary Levels
  • Launch and Space Environments

Embedded Conference on SIPI

As high-speed designs continue evolving, signal/power integrity and other EMC problems become tightly related to each other. The embedded conference on Signal and Power Integrity (SIPI), which is an integral part of the 2018 Joint IEEE EMC & APEMC Symposium, provides a unique opportunity for attendees to exchange ideas and share experiences relevant for today’s high-speed designs.

SIPI-TPC Chairs:
Zhiping YANG (zhipingyang@google.com)
Er-Ping LI (erpingli@ieee.org)

Topics include but not limited to the following TC-10 technical areas.
    * High-Speed Interconnect Design and Optimization (Component and/or System Level)
    * Interconnect Modeling and Extraction
    * Channel Analysis

Power Delivery Network and Decoupling
    * PDN (power delivery network) design and Optimization
    * Design, Analysis, Simulation, Modeling and Measurement Techniques
    * Power Supply Induced Jitter

Chip Level
    * On-Chip and Off-Chip High-Speed Signaling Techniques
    * 3-D IC and TSV
    * Advanced Packaging

Tools and Methodologies
    * Jitter/Noise/Crosstalk/BER Budgeting, Analysis, and Measurement
    * De-embedding Method
    * Time Domain and Frequency Domain Measurement Techniques
Simulation and Modeling Techniques
    * High-Frequency and Electromagnetic Simulation Techniques
    * Simulation and Measurement Correlation
    * Advanced Simulation Tools/Algorithms
    * Device Modeling and Characterization
    * Multiphysics Modeling for Analog/RF/MEMS/ Optical Chip-Package-Systems
    * Macromodeling and Model Order Reduction for Signal and Power Integrity

System Co-Design
    * Signal/Power integrity for Chip/Package/Board/ Connector/Cable Design
    * Signal Integrity and Power Integrity Co-Analysis
    * System-Level SI/PI/EMI Co-Design

    * RF, Microwave and Mixed Signal Analysis
    * Silicon Photonics

More Information

Student Paper Contest

Graduate and undergraduate authors are eligible for the Best Student Paper contest. The student must be the primary author and should indicate that they wish to be considered for the contest when submitting the preliminary manuscript. Each student’s professor will be asked to certify that the paper is primarily the work of the student.

Special Issues of IEEE Transactions on EMC 

Authors of accepted papers will be invited to submit an extended version of their symposium paper for possible inclusion in a special issue of the IEEE Transactions on Electromagnetic Compatibility featuring papers from the EMC/APEMC 2018. These submissions will be subjected to the same rigorous review as papers submitted for publication in regular issues of the IEEE Transactions on EMC.

Paper Acceptance Criteria

Importance of Topic: Does it have direct significance to the EMC community?

Technical Sophistication and Depth: Does it present information that is a significant contribution, advancement, application or refinement of the state of the art? Does it expose the reader to a higher knowledge level than currently available from other sources?

Readability, Clarity and Presentation: Is the value of the submission clearly defined? Is the material written in clear and concise English, with topics presented in an organized and logical manner?

Novelty and Originality: Does it propose a new and unique concept or expand on an existing premise from a unique point of view?

Paper Presentation Formats

Traditional Oral presentation: Presentation for those interested in presenting to large groups with limited potential for interactions with attendees.

Open Forum: Presentation for those interested in direct interaction with individuals or small groups.

Guidelines for Authors & Submittal Procedures

Prospective authors must submit electronically**.

A preliminary full manuscript (less than 6 pages) including all relevant results and conclusions.

Choice of presentation format (traditional oral or open forum).

** Preliminary Manuscripts and Final papers are to be submitted using the link provided on the symposium website after 18 August  2017. During the electronic submission process a unique author code is created for tracking purposes. Submissions are reviewed anonymously, so please do not include author names or affiliations on the Preliminary full Manuscript. Failure to comply with submission requirements may result in rejection.

© 2018 Joint IEEE EMC & APEMC