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Topical Meetings

Instruction for TM Paper Submissions
Full paper or Abstract Paper Submission Portal Paper Template (WORD) Deadline

Submit Preliminary Full Papers

23 Dec. 2017
Submit Abstract-Reviewed Papers

08 Jan. 2018

Topical Meeting Details

              
TM1 | IC EMC
Chair(s):
• Sonia Bendhia (sonia.bendhia@insa-toulouse.fr)
• Bernd Deutschmann (bernd.deutschmann@tugraz.at)
• Fabian Vargas (fabian.luis.vargas@gmail.com)
• Er-Ping LI (liep@zju.edu.cn)
Topics:
Design of 2D and 3D system-on-chip (SoC) for EMC
Hardware-software co-design and integration for IC EMC
Emission and immunity-aware IC design
ESD immunity techniques at IC level
Signal and power integrities at IC level
Combined effects of radiation and aging on IC EM sensitivity
Harsh environment effects on IC EM sensitivity
IC EMC for avionics and automotive applications
EMC-aware analog and mixed signal circuits
RF ICs EMC
IC-level measurement techniques for EMC
IC-level modeling techniques for EMC
EMC simulation of ICs
EMC in microwave ICs
EMC-aware software solutions
FPGA-based embedded systems and EMC
TM2 | EMC IN RAILWAY SYSTEMS
Chair(s):
• Kai Sang Lock (KaiSang.Lock@SingaporeTech.edu.sg)
• Samuel Chan (Samuel_Chan@lta.gov.sg)
• Peter Sai-Wing Leung (eeswl@cityu.edu.hk)
    Topics:
EMC and Railway Safety
EMC effects in Traction Power Supply and Systems
EMC effects in Signaling and Communication Systems
Rolling stock EMC issues
Power quality and low frequency EMC
Emission and Immunity of onboard systems
EMI and Electromagnetic Environment Effects (E3) on Train operations
Lightning electromagnetic pulse (LEMP) Protection
Railway EMC Measurements and Instrumentations
Modelling and Simulation methods for railway EMC
EMC of High-Speed Trains
Railway EMC Standards
EMC management
Railway equipment EMC assurance
Spectrum management
Contemporary issues and challenges
Railway EMC in education and professional development
Sharing of case studies and project experiences
TM3 | WIRELESS POWER TRANSFER
Chair(s):
• Seungyoung Ahn (sahn@kaist.ac.kr)
• Eakhwan Song (esong@kw.ac.kr)
Topics:
* Wireless Power Transfer Devices and  Systems
Rectennas and rectenna arrays; Coils, Resonators; Techniques for energy harvesting and scavenging ; High-frequency power transmitters and devices; High-efficiency rectifying circuits and devices.

*Applications of Wireless Power Transfer Technologies
Home appliances; Personal devices; Mobile devices; Computers; RF-ID; Electric vehicles; Trains,  Medical devices ;Space/aeronautic applications.

*Technologies for Wireless Power Transfer
Microwave transmission; Inductive and resonant power transfer technologies; DC-DC converters; Power conditioning; Power control methods  ; Power management and power electronics for WPT ; Magnetic field forming and Shielding methods, EMF/EMI issues, Meta-material,etc.
TM4 | ​TM4 (SC-5) - EMC IN POWER ELECTRONICS AND SMART GRID
Chair(s):
• Henglin Chen (henglin@zju.edu.cn)
• Shuo Wang (shuo.wang@ece.ufl.edu)
• Yanzhao Xie (yzxie@mail.xjtu.edu.cn)
• Flavia Grassi (flavia.grassi@polimi.it)
     Topics:
EMC issues in smart substation and high voltage apparatus
EMC issues in renewable energy power electronics
EMC issues in wireless power transfer systems
EMC issues and challenges with electric vehicles
EMI modeling and simulation for power converters
EMI modeling and simulation for motor drives
EMI modeling for power devices and components
EMI mitigation technology for power electronics
EMI challenges with wide band-gap semiconductor devices
Transient electromagnetic environment of power system
Power electronics technology for improving power quality
Common mode noise problems with motor drives in electric vehicles
Case studies and project experiences with power electronics EMC
EMC measurement and standards
Active and passive EMI filters
TM5 | Biomedical Electromagnetics
Chair(s):
• Koichi ITO (ito.koichi@faculty.chiba-u.jp)
• Jianqing Wang (wang@nitech.ac.jp)
• Shaoying Huang (huangshaoying@sutd.edu.sg)

Five Topical Meetings embedded in One Symposium


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© 2018 Joint IEEE EMC & APEMC