APEMC 2022 Advance program
is ready for download.
Widespread and frequent occurrence of COVID-19 pandemic in many parts of China has caused severe challenge for the country’s epidemic prevention and control. In order to fully cooperate with and implement the epidemic prevention and control requirements of the China central and Beijing municipal government, effectively ensure APEMC2022 delegates’ physical health and safety as well as good APEMC2022 results, APEMC2022 organizing committee has decided to postpone APEMC2022 which was initially planned on May 8-11, 2022 to Sept. 01-04, 2022 in Beijing International Convention Center.
We will pay close attention to the development of the epidemic, and strive to enhance the event’s organization and service work according to the requirements of the epidemic prevention and control policy and ensure the successful organizing of APEMC2022.
We deeply appreciate the delegates, partners and exhibitors and people from all walks of life for their support to APEMC2022!
Thank you for your understanding and supports.
鉴于目前国内新冠肺炎疫情防控形势，为全力配合和落实国家及北京市疫情防控要求，切实保障参会代表、合作伙伴和业界同仁的身体健康和公共卫生安全，确保良好的会议与展会召开效果，原定于2022年5月8日-11日在北京国际会议中心举办的第十三届亚太电磁兼容国际会议暨展览会(APEMC2022)将延期至9月1日-4日在北京国际会议中心举办。
一直以来，第十三届亚太电磁兼容国际会议暨展览会(APEMC2022)组委会始终把保障参会代表、合作单位和大家的生命健康安全置于首要位置。对于APEMC2022延期召开给您带来的不便，我们深表歉意！我们将做好各项准备组织工作，确保APEMC2022成功召开。
2022中国电磁兼容周也将同时延期到2022年9月1日-4日在北京国际会议中心举办。
非常感谢大家一如既往的支持与参与！请您们及时调整行程安排并告知相关合作伙伴。
在2022年APEMC大会上发表信号完整性和电源完整性相关的论文作者都被邀请将其论文的扩展版本(extend papers)提交给 IEEE Transactions Signal and Power Integrity。每一篇论文都将由该期刊以与其他定期提交的论文相同的方式进行审查。
Authors of SIPI-related papers presented at APEMC 2022 are invited to submit an expanded version of their papers to IEEE Transactions on Signal and Power Integrity. Every paper will be reviewed by the journal in the same manner as all other regular submissions.
Your submission to IEEE Transactions on Signal and Power Integrity must meet the following three requirements:
1. Extension Requirement
Submissions will be reviewed to determine if the manuscript includes substantially new technical content beyond the Symposium paper; whether the past work including the Symposium paper or Transaction paper is adequately referenced; and whether the new results are placed in proper context with respect to the prior work and existing state-of-the-art. Typically, 50% or more of technical content extension is expected. Unlike a Symposium paper that might present preliminary results, a manuscript submitted to IEEE Transactions on Signal and Power Integrity is expected to present more complete and validated results. With the submission, please include a copy of your symposium paper.
2. Manuscript Preparation
All submissions must be made through the IEEE’s Author Portal website: https://ieee.atyponrex.com/journal/TSIPI. When you arrive at the site to submit your manuscript, you will first need to create an IEEE account or log in using your existing IEEE account credentials, if you already one. Once you have logged into the Portal, choose “Start submission” and follow the prompts to submit your manuscript. Please make sure to add the following in the footnote on the first page of the paper: “This paper is an expanded version from the 2022 ASIA-PACIFIC INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY”.
3. Submission Deadline
Because the extended paper should respond to, and incorporate, the feedback from the Reviewers, the submission window is May 12, 2022 to August 11, 2022. In other words, the deadline for submission is August 11, 2022. This deadline is firm and papers designated with the footnote after this date will be returned without review.
为表彰在电磁兼容领域彰显创新及领导力、为电磁兼容发展做出卓越贡献的科学家、工程师和优秀青年学者，本届 APEMC 2022 在设立“最佳会议论文奖”、“最佳学生论文奖”和其他技术及成就奖的同时，新增“最佳会议摘要奖”。
In order to recognize scientists, engineers and young scholars who have demonstrated innovation and leadership in the field of electromagnetic compatibility (EMC) and have made outstanding contributions to the development of ELECTROMAGNETIC compatibility (EMC), the APEMC 2022 will introduce the “Best Conference Paper Award”, “Best Student Paper Award” and other technical and achievement awards, as well as the “Best Conference Abstract Award”.
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