Symposium Committee
Symposium Committee
APEMC President
LI Er-Ping
EMC Week General Chair
SU Dong-Lin
Technical Program Committee Chairs
FAN Jun
LIU En-Xiao
Secretary
Sara Gou
GU Zheming
Symposium Committee
Symposium Committee
APEMC President
LI Er-Ping
EMC Week General Chair
SU Dong-Lin
Technical Program Committee Chairs
FAN Jun
LIU En-Xiao
Secretary
Sara Gou
GU Zheming
TC-1 EMC Management, Standards and Regulations
Chairs:
Frank Leferink
Jianfei WU
TC-2 EMC Measurements and EM Environment
Chairs:
Xingchang Wei
Xiaoming Chen
TC-3 Lightning
Chair:
Yoshihiro Baba
TC-4 High Power Electromagnetics
Chairs:
William Radasky
LiHua Shi
TC-5 System-Level EMC and Protection
Chairs:
Richard Xian-Ke GAO
Yanzhao Xie
TC-6 Transportation EMC, Automotive/Railway/Ship EMC
Chairs:
Sergio Pignari
Yinghong Wen
Chair:
Qi WU
TC-8 Smart Grid and Low Frequency EMC
Chairs:
Henglin Chen
Weidong Zhang
TC-9 IC and Semiconductor EMC
Chairs:
Sonia Ben Dhia
Shurun Tan
TC-10 Signal Integrity and Power Integrity
Chairs:
Lijun Jiang
Liang Zhou
Chairs:
Wei E. I. Sha
Zhixiang Huang
Chairs:
Jianqing Wang
Guizhi Xu
TC-13 Wireless Communication EMC
Chairs:
GuoQing Luo
Zhangcheng Hao
TC-14 Nanotechnology and New Materials
Chair:
Wenchao Chen
Adrijan Baric
Univeristy of Zagreb
Alistair Duffy
De Montfort University
Anxue Zhang
Xi’an Jiaotong University
Bernd Deutschmann
ESEO
Bo Pu
Ningbo Detu Science & Technology Corporation
Christian Schuster
Hamburg University of Technology
Chulsoon Hwang
Missouri University of Science and Technology
Da Li
Zhejiang University
David Pommerenke
Graz University of Technology
Dazhi Ding
Nanjing University of Science and Technology
Ding-Bing Lin
National Taiwan University of Science and Technology
Dongsheng ZHAO
RHEA System B.V.
Farhad Rachidi
Swiss Federal Institute of Technology
Flavia Grassi
Politecnic Milano
Han Hu
Intel, Shanghai
Hongxin Zheng
Hebei University of Technology
Huapeng Zhao
University of Electronic Science and Technology of China
Janet O’Neil
ETS-Lindgren
Jingook Kim
Ulsan National Institute of Science and Technology
Jose E. Schutt-Aine
University of Illinois at Urbana-Champaign
Junping He
Harbin Institue of Technology
Makoto Nagata
Kobe University
Masahiro Yamaguchi
Tohoku Univeristy
Meng Cui
ESEO
Mohammed RAMDANI
ESEO
Morten Sørensen
University of Southern Denmark
Qi Yi Hong
DBJ Technologies, Canada
Qiang Cui
China Electronics Standardization Institute
Qiang Ren
Beihang University
Qiangming Cai
Southwest University of Science and Technology
Qinghai Wang
Huawei Tech CO.
Qingsheng Zeng
Nanjing University of Aeronautics and Astronautics
Qing-Xin Chu
South China University of Technology
See Kye yak
Nanyang Technological University
Shishan Wang
Nanjing University of Aeronautics and Astronautics
Si-Ping Gao
National University of Singapore
Xiangyu Cao
AF Engineering University
Xinghai Zhang
Huawei Tech CO.
Xinglin Sun
Zhejiang University
Xiuqing Chu
Xidian University
Yan Li
China Jiliang University
Yongsheng Li
Hisilicon Co.
Yongxin Guo
National University of Singapore
Yuichi Hayashi
Nara Institute of Science and Technology
Zhiping Yang
Waymo
Zhongxiang Shen
Nanyang Technological University
Hong Li
Beijing Jiaotong University
Fan Yang
Tsinghua University
Junqi Zheng
Shanghai Electrical Apparatus Resrearch Institute
Yazhou Chen
PLA Engineering University
Zhongqun Li
Ceyear Technologies Co., Ltd
Meng Jin
Naval University of Engineering
Mingyao Xia
Peking University
Peiguo Liu
National University of Defense Technology
Quanyuan Feng
Southwest JiaoTong University
Da YI
Chongqing University
MengJun Wang
Hebei University of Technology
Yongjian LI
Hebei University of Technology
Jingkun Mao
Tianjin University of Technology
Daryl Beetner
Missouri University of Science and Technology
HONG Wei
Jame Drewniak
JIN Jianming
LI Er-Ping
LIU Yuanan
LIU Shanghe
MAO Junfa
NIAN Fushun
SU Donglin
WU Ke
ZHANG Yueping
En-Xiao Liu (Singapore)
Er-Ping Li (China)
Joungho Kim (South Korea)
Mark Mifsud (Australia)
Osami Wada (Japan)
Tzong-Lin Wu (Taiwan)
Lijun Jiang (Hong Kong, China)