Supplement on APEMC 2008

Tutorial 1:  Printed Circuit Board and System Design for Technology of the Future

Abstract
Technology of today, when designing systems for both EMC compliance and functionality, has advanced to a state where current design techniques are becoming less effective. A new view of the field of electrical engineering must occur if one is to be successful based on what the future may bring with higher speed components, greater power consumption, higher bandwidth interconnects, along with light-weight enclosures and their relationship to shielding effectiveness.

This course has a focus toward hands-on or applied engineering along with fundamentals of both time- and frequency-domain aspects of system design. Without understanding what Maxwell tells us, we can spend considerable time, money and effort experimenting to achieve EMC. After a thorough examination of EMC fundamentals, we proceed onto advanced topics.

All EMC problems begin and end with electronic circuitry. One must recognise there are second and third order effects that may cause system-wide failure. EMC engineers of today also need to understand both signal integrity (time domain) as well as EMI (frequency domain), along with advances in printed circuit board manufacturing technology, system reliability, lossy transmission line implementation, and the use of new, higher-speed printed circuit board materials for GHz- based systems.

Realising that suppression of EMI at the component and printed circuit board level is nearly impossible for most applications, shielding becomes the final solution to solving EMC. Internal radiated field coupling, light-weight plastic enclosures, Gigahertz signals, and numerous other variables must be understood for a cost effective design. In addition, if improper handling of return currents (what is generally called grounding) is ineffective, additional problems may occur. One must consider the overall system level design aspect of a product for EMC, and not focus strictly at the printed circuit board or how well an enclosure performs. In addition, new test procedures are being required to evaluate systems at higher frequencies

This tutorial is proposed to be a full-day activity with an hour for lunch along with a morning and afternoon break. The following topics will be presented, covering printed circuit board design requirements (signal integrity and EMI suppression), manufacturing processes, system analysis, and other areas of systems engineering that affects EMC.

Tutorial Outline:

Tutorial 2:  Introduction of Reverberation Chambers
Organizer:  Dr. G. Freyer, USA

Abstract
The Workshop will provide a tutorial overview of the concepts of electromagnetic testing with reverberation chambers. The Workshop should be particularly useful to individuals with EMC test experience as an indication of how the electromagnetic environment in reverberation chambers differs markedly from other test techniques. It will also emphasise how test planning, conduct, and data processing and analysis must use statistical processes.

Speakers:
G. Freyer
C. Bunting

Tutorial 3:  EMC and Modern Power Electronic Systems
Organizer:  F. Zare, Queensland University of Technology, Australia

Abstract
The purpose of this tutorial is to address basic and advanced concepts of EMC in modern power electronic systems which help EMC experts to analysis EMC problems of power electronics used in different applications. Introducing power electronics in details such as transformer and motor design, modulation strategy, switching losses to EMC experts may open a new research area and help development engineers to find better solutions to minimise source of EMI noise at the development phase and improve cost, size and performance of the system.

Tutorial Outline:

F. Zare         Power Electronics: topologies, applications, pulse width modulation

Major EMI problems in power electronic systems

Active EMI filters used in motor drives

Methods to predict and minimise conducted emission noise in motor drive systems

Important feedback from EMC experts to development engineers

Tutorial 4:  Fundamentals of Grounding, from Circuit to System
Speaker:  E.B. Joffe, Israel, President of IEEE EMC Society

Abstract
One of the problems with grounding is the term itself... it's too vague; Often a single ground may serve multiple needs, with different rule to each.

The discipline of Electromagnetic Compatibility (EMC) is concerned with the design of Electronic Systems, while minimizing electromagnetic coupling and interference from within the system and between the system to its environment. The discipline of electromagnetic compatibility covers and requires involvement in a wide range of other fields of engineering, system engineering and electronic engineering, etc.

The concept of "grounding" is probably among the most important, yet less understood topic of electronic design, often considered as "black magic". Yet grounding forms an inseparable part of all electronic and electrical designs, from circuit through system up to installation design. Grounding is implemented for EMC and ESD protection, for safety purposes, for lightning and surge protection, etc.

This presentation is intended to shed some light on the concepts and pitfalls associated with grounding - an essential and inseparable concept in EMC design.

The presentation will cover the rational and fundamental concepts of grounding and its topologies, leading to the implementation of grounding from circuit to system. Practical applications will be extensively discussed. Practical solutions to practical problems, as well as "real life case studies" are used as examples.

Elya  Joffe is the Vice-President of Engineering of K.T.M. Project Engineering, an engineering consulting company in Israel. Mr Joffe has over 20 years of experience  in EMC. He is also a member of the Board of Directors and President of the IEEE EMC Society (EMCS) .  Mr. Joffe served as a "Distinguished Lecturer" of the IEEE EMC Society, for the years 1999 through 2000. He is a Registered Professional Engineer and a NARTE Certified EMC and ESD Control Engineer. Mr Joffe is also a member of a prestigious fraternity of EMC Engineers - "The dB Society". He served as various capacities for numerous international conferences, and  received number of prestigious  awards from IEEE EMC society and published number papers.

Tutorial 5:  Powering and Grounding for Mission Critical Facility
Speaker:  Lock K. S., Principal PQR Consultants, Singapore

Abstract
Power quality refers to electromagnetic compatibility between power supply characteristics and operation tolerances of electrical and electronic equipment. Increasingly, EMC incompatibilities are causing widespread disruption to operation of sensitive electronic and electrical equipment in industrial and commercial facilities leading to severe operation problems and financial losses.

This half-day course provides a good understanding of various power quality problems - mainly in the forms of voltage disturbances such as dips, transients and surges, flickers and harmonic waveform distortions.  The issue of power supply and equipment grounding, often complicated by conflicting demands for dealing with electrical noise and safety simultaneously, will be discussed.

Tutorial Outline:

Lock K. S      Nature of power supply problems

Electromagnetic compatibility between loads and supply characteristics

Grounding and bonding for electrical and lightning protection

Integrated grounding and bonding for safety and electrical noise control

Trouble-shooting power quality problems and recommended solutions

Case studies

Workshop 1:  IC Packaging, PCB EMC and Signal Integrity
Organizer:  Dr. Er-Ping Li and Dr. Joungho Kim

Abstract
Clock frequencies of high-speed semiconductor IC's, packages, and systems are increased over GHz frequency ranges. Management of current wave propagation, loss, decoupling, resonance, and radiation at the power distribution network(PDN) and the return current path becomes a crucial part of the IC, package, and system co-design in order to maintain power and ground integrity of the system.

In this workshop, we will discuss the fundamental design principles and challenges to achieve the low noise PDN, and the return current path by applying the concepts of the chip, package, and PCB PDN co-design. The topics include PDN impedance control, inductance management, optimal decoupling scheme, cavity resonance, and electromagnetic emission. In addition, we will introduce the noise generation and coupling issues by return current path break at the PDN and the signal line. Effects of the return current discontinuity will be discussed including common impedance coupling, crosstalk, and radiated emission. Finally, impact on the degradation of timing and noise margin, and system reliability will be covered.

Workshop Outline:

Workshop 2:  RF Biological Effects and Standards Update
Speaker:  Dr. C.K. Chou, Motorola, USA

Abstract
The dramatic increase in man-made radio frequency (RF) fields in the environment during the last few decades has led to public health concerns in many parts of the world.  Specifically, questions have been raised on the safety of exposure to RF energy emitted from radar, television and radio communication systems, microwave ovens, video display terminals, and most recently, mobile telephones and base stations, Wi-Fi and WiMAX.  The WHO EMF database now has more than 1600 original, peer-reviewed papers useful for public health risk assessment of RF exposure. In this presentation, recent epidemiological, human, animal and in vitro studies will be summarised. There have been many reported low intensity electromagnetic wave biological effects, but none of the "non-thermal effects" can be independently replicated or shown to be harmful.  Reviews of independent expert panels and health authorities will be discussed also. All of these reviews have consistently concluded that there is no credible or convincing evidence that RF exposure within ICNIRP limits causes adverse human health effects.  Proper engineering and biological study designs will be emphasised to ensure any observed effects are genuine RF-field induced effects and not due to experimental artefacts.  RF dosimetry will be emphasised because the complexity of RF dosimetry is part of the reason why there are so many controversial reports in the literature.  Recently developed standards for protecting human health as well as measurement standards for RF emitting devices for compliance requirements will be discussed. Safety standards include the new IEEE C95.1 human exposure guidelines and IEEE C95.7 RF safety program recommendations. The IEEE C95.1 standard will be compared to the 1998 guidelines of the International Commission on Non-Ionising Radiation Protection. An overview of global RF safety regulations will be presented. Measurement standards to be discussed include IEEE 1528 and IEC 62209 part 1 (characterising mobile phone exposure in the head) and IEC 62209 part 2 (two-way radios and body worn devices). Harmonisation of both RF safety and measurement standards is important for minimising confusion in global regulations and public concerns.

Workshop 3:  Managing Regulatory Access to Asia Pacific Markets
Organizer:  Dr. Kwok Soohoo, IBM, USA

Abstract
Markets in the Asia Pacific region are heavily sought after, but keeping up with technical regulations around the world can be a challenge.  EMC regulatory requirements vary widely, and rules regarding testing, product certification, declaration of conformity, registration, and MRAs (Mutual Recognition Agreements) can be confusing and costly for manufacturers and the test labs and certification bodies who serve them to effectively market their products in these countries. In this workshop, participants will learn about the EMC regulatory requirements of various Asia Pacific countries, as well as the U.S. and Canada, and the steps that are necessary in order to successfully market a product to some of the countries in this region.

Speakers: