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Steps to 2018 EMC (click to see the large figure)


Paper Submission Portal is Right Here Waiting for You!
Click the icons on the right to submit a full-paper or an abstract.
  • Two flagship EMC symposiums --- the 60th IEEE International EMC & the 9th APEMC --- are fused into one: 2018 Joint EMC Symposium in Singapore
  • Paper and proposal submission is open since 18 August 2017

Important Dates

  • Preliminary Full Paper Submission
    (3 to 6 pages in PDF format; No author names & affiliations)

Start:  18 Aug 2017

End:    24 Nov 2017

  • Abstract Reviewed Paper Submission
    (with author names & affiliations)

Start:  18 Aug 2017

End:    08 Jan 2018 
  • Paper Acceptance Notification
Jan 2018
  • Final Paper Deadline
    (second-round paper submission)

28 Feb 2018

  • Proposal Submission
    • Special Session Proposal
    • Workshop & Tutorial Proposal
A big thank-you for your overwhelming response!
  • Proposal Acceptance Notification 

07 Nov 2017

Welcome to 2018 Joint EMC Symposium

The 2018 Joint IEEE International Symposium on Electromagnetic Compatibility & Asia-Pacific Symposium on Electromagnetic Compatibility (2018 Joint IEEE EMC & APEMC) will take place at the Suntec Convention and Exhibition Center in Singapore from 14 to 17 May 2018.

    The joint symposium combines the 60th IEEE International Symposium on EMC with the 9th APEMC Symposium. For the former, it is only the 4th time for it to be held outside the North America Continent in 60 years and the first time in Asia over the past three decades. For the latter, it is a homecoming to where the APEMC originated 10 years ago.

    The symposium Technical Program Committee invites you to submit your original and unpublished papers and/or abstracts in all aspects of electromagnetic compatibility (EMC) as well as signal and power Integrity (SI/PI), including but not limited to EMC/SI/PI design, modeling, management, measurements, and education. All eligible papers will be published online at the IEEE Xplore, as conference proceedings, in a special issue of IEEE Transactions on Electromagnetic Compatibility and IEEE EMC Magazine.

    Plan ahead and join this unique symposium, meet international colleagues, present your latest research findings, share your insight and perspectives, ask questions, learn from experts and innovators, explore collaborations, visit exhibitions and see new products. Experience Singapore, where east meets west, and much more!

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© 2018 Joint IEEE EMC & APEMC